发明名称 |
Bump forming method, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
摘要 |
A bump forming method having a step of patterning a resist layer so as to have a penetrating hole above a pad, a step of applying energy to cause cross-linking in the resist layer, and hardening at least a surface of the resist layer, and a step of forming a metal layer electrically connected to the pad within the penetrating hole.
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申请公布号 |
US2002061641(A1) |
申请公布日期 |
2002.05.23 |
申请号 |
US20010984223 |
申请日期 |
2001.10.29 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
YODA TSUYOSHI |
分类号 |
H05K3/34;H01L21/60;(IPC1-7):H01L21/44 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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