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发明名称
BONDING COMPOSITION WITH COHESIVE FAILURE
摘要
<p>The invention concerns a novel bonding composition comprising at least a hot-melt and at least a binder. Said composition is useful in multilayer structures, and in packages.</p>
申请公布号
WO2002040610(A1)
申请公布日期
2002.05.23
申请号
FR2001003600
申请日期
2001.11.16
申请人
发明人
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主分类号
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