发明名称 |
Positive photoresist composition |
摘要 |
A positive photoresist composition includes (A) an alkali-soluble resin and (B) a photosensitive ingredient, in which the photosensitive ingredient (B) includes an ester of a compound represented by following Formula (I) with a 1,2-naphthoquinonediazidosulfonyl compound: This positive photoresist composition can form a resist pattern mixture including both a dense pattern and an isolation pattern with good shapes and can especially minimize the formation of a back taper shape of an isolation pattern induced by shift of the focus to the minus side.
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申请公布号 |
US2002061458(A1) |
申请公布日期 |
2002.05.23 |
申请号 |
US20010949863 |
申请日期 |
2001.09.12 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
HIDESAKA SHINICHI;SAWANO ATSUSHI |
分类号 |
C08K5/00;C08K5/42;C08L101/00;G03F7/004;G03F7/022;G03F7/032;H01L21/027;(IPC1-7):G03F7/023;G03F7/30 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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