MULTIDIMENSIONAL ULTRASONIC TRANSDUCER ARRAYS

摘要

A two dimensional ultrasonic transducer array stack is described which has a backing block of acoustically absorbent material formed of alternating plates of backing material and flex circuits adhesively bonded together. The thickness of the plates establishes the elevational dimension between the flex circuits and corresponds to the elevational pitch of the two dimensional array. The backing block may also be formed by photoetching conductive traces directly on the plates of backing material, which are then adhesively bonded together to form the backing block.