| 摘要 |
<p>A sputtering target producing few particles, a backing plate or a sputtering apparatus, and a sputtering method producing few particles. An arc-spraying coating film and a plasma-spraying coating film over the former are formed on the sputtering target, a backing plate, or another surface in the sputtering apparatus, where an unwanted film might be formed. Thus a deposit is prevented from separating/flying from the target the backing plate, or the another surface where an unwanted film might be formed in the sputtering apparatus.</p> |
