| 发明名称 |
Modified plating solution for plating and planarization and process utilizing same |
| 摘要 |
A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) at least one additive to improve electrical and structural properties, and (4) a modifying agent.
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| 申请公布号 |
US2002061715(A1) |
申请公布日期 |
2002.05.23 |
| 申请号 |
US20020042244 |
申请日期 |
2002.01.11 |
| 申请人 |
NU TOOL INC. |
发明人 |
UZOH CYPRIAN;BASOL BULENT;TALIEH HOMAYOUN |
| 分类号 |
B24B37/04;C25D3/38;C25D7/12;H01L21/288;H01L21/321;H01L21/768;H01L23/532;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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