发明名称 Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
摘要 Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a product sized is obtained.
申请公布号 US2002060210(A1) 申请公布日期 2002.05.23
申请号 US20010951439 申请日期 2001.09.14
申请人 SEIKO EPSON CORPORATION 发明人 TERADA SHOICHI;YOSHIMURA KAZUTO;MASUDA KENJI;ITO HIDEHIRO
分类号 G02F1/13;B23K26/00;B23K26/06;B23K26/067;B23K26/08;B23K26/38;B23K26/40;B23K101/36;C03B33/07;C03B33/09;G02F1/1333;H01S3/00;(IPC1-7):B23K26/38 主分类号 G02F1/13
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