发明名称 |
Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device |
摘要 |
Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a product sized is obtained.
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申请公布号 |
US2002060210(A1) |
申请公布日期 |
2002.05.23 |
申请号 |
US20010951439 |
申请日期 |
2001.09.14 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TERADA SHOICHI;YOSHIMURA KAZUTO;MASUDA KENJI;ITO HIDEHIRO |
分类号 |
G02F1/13;B23K26/00;B23K26/06;B23K26/067;B23K26/08;B23K26/38;B23K26/40;B23K101/36;C03B33/07;C03B33/09;G02F1/1333;H01S3/00;(IPC1-7):B23K26/38 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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