ELECTROSTATIC CHUCK AND METHOD OF FABRICATING THE SAME

摘要

Apparatus for protecting a substrate and a support surface of a substrate support chuck comprising a protective coating (100) of a diamond-like carbon-based material deposited upon the support surface. The protective coating may also contain silicon-based materials. The protective coating is deposited via plasma-enhanced CVD and is approximately in the range of 1 - 5 mu m thick. The apparatus may also have a wafer spacing mask (110) disposed upon the protective coating. A method of fabricating a substrate support chuck is also disclosed and comprises the steps of forming a chuck body having a support surface and depositing a carbon-based material over the support surface of said chuck body to form a protective coating (100). Optionally, a step of depositing a wafer spacing mask (110) upon the protective coating may be added. The protective coating results in a substantial decrease in contamination of chucks, wafers and the process chamber environment.