METHOD FOR FABRICATING CHIP SIZE PACKAGE

摘要

PURPOSE: A method for fabricating a chip size package(CSP) is provided to improve capability and miniaturize a semiconductor package by molding the semiconductor package in such a way to directly attach a signal withdrawal terminal to a chip pad formed on a semiconductor chip. CONSTITUTION: A printed circuit board(PCB) is penetrated to form a through hole(7) and an air vent(8). The through hole is plated and a plurality of interconnection patterns(5) are formed on and under the PCB. The gap between the interconnection patterns on the PCB where the through hole and the air vent are not formed is covered with solder resist or polyimide(9). An aluminum pad(2) on the semiconductor chip(1) and the interconnection pattern on the PCB are attached to each other by using a gold bump(4). The gap between the PCB and the semiconductor chip is filled with a coating material(4), resin. Solder balls(10) are formed in the interconnection patterns formed under the PCB.