ADHESIVE COMPOSITION AND ADHESIVE MEMBER USING THE SAME AND SUBSTRATE FOR LOADING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain both an adhesive composition capable of forming an adhesive member having heat and moisture resistances required when a semiconductor element having a large difference in coefficient of thermal expansion is packaged in a substrate for loading a semiconductor and capable of suppressing volatiles during the use thereof and the adhesive member using the adhesive and to provide both the substrate for loading the semiconductor and a semiconductor device having excellent operating efficiency. SOLUTION: This adhesive composition comprises (a) 100 pts. mass of an epoxy resin and a phenol resin having <=20 mass% content of a low-molecular weight component having <=500 molecular weight and <=30 mass% content of a low-molecular weight component having 1,000 molecular weight ad (b) 10-400 pts. mass of a high-molecular weight component containing functional groups and having >=100,000 weight-average molecular weight. The adhesive member is obtained by forming the adhesive composition into the form of a film. The substrate for loading the semiconductor is provided with the adhesive member. The semiconductor device is prepared by bonding a semiconductor chip thereonto.