| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding material of an epoxy resin for sealing little in chip shift, and excellent in reflow crack resistance and void resistance even in a thin surface mounting-type package, and an electronic part device having elements sealed with the material. SOLUTION: The molding material of an epoxy resin for sealing is composed of (A) an epoxy resin, (B) a hardener, (C) a hardening accelerator and (D) a filler as the essential components, and has a disk flow of >=70 mm. The electronic part device has elements sealed with the epoxy resin molding material for sealing.
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