| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide resin composition having excellent low warpage, flexibility, adhesion to an encapsulant of electronic parts and solvent and chemical resistances, soluble in a nonnitrogen polar solvent and having low- temperature curability and excellent heat and moisture resistances, electrical characteristics, operability and economical efficiency and a film-forming material using the polyimide resin composition and having the excellent characteristics. SOLUTION: This polyimide resin composition comprises a polyimide resin having a repeating unit represented by the general formula (I) (wherein, plural Rs denote each independently a 1-18C alkylene group; plural Xs denote each independently a 1-18C alkylene group or an arylene group; m and n each denote independently an integer of 1-20; and Y denote a tetravalent organic group).
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