Method of separating a slice base mount and jig for it

摘要

A method of separating a slice (W) base mounting member (C) such as a carbon member from sliced wafers (W), and a jig (1) which is used in the method, are disclosed. The method comprises the steps of: supporting a plurality of wafers (W) having their slice base mounting members in a stacked state preferably in jig (1) and separating the slice base mounting members (C) from the stacked wafers (W). Typically the separation is performed after a soaking step in a separating liquid and preferably after subjecting them to a shock wave generated by ultrasonics or compressed air. The mounting member (C) is preferably urged in a direction in the plane of the wafers (W) away from the wafers.