| 摘要 |
The present invention provides a method and apparatus to package and electrically connect a microdisplay that includes a cavity package design. This cavity package design improves the packaging of the microdisplay by using a low number of parts, less processing, and is independent of the customer's interconnect. Structurally, the invention is a unified part, forming a cavity for insertion of a microdisplay cell. Additionally, the cavity package incorporates a variety of test features for ease of testing. Also, the cavity package is a small size and includes multiple mounting options allowing flexibility to customer changes and multiple configurations. <??>A cavity packaging system constructed in accordance with the invention has a total of five components including the cacity package, the FPC, the microdisplay cell, the adhesive, and the aperture frame. The cavity package has five parts, including the interconnect bar (402), the substrate (404), the plastic housing (406), the interconnect pins (408), and the shroud (410). The substrate (404) and interconnect bar (402) are insert molded into a plastic housing (406). Interconnect pins (408) are inserted into the resulting frame and protected by a plastic shroud (410) that fits over them. <IMAGE> |
