APPARATUS AND METHOD FOR CUTTING SINGLE GLASS SUBSTRATE BY USING LASER

摘要

PURPOSE: An apparatus and a method for cutting a single glass substrate are provided to cut the single glass substrate from an upper portion thereof by using a laser cutter while preventing an active area of the single glass substrate from being damaged. CONSTITUTION: A laser cutting apparatus includes a laser cutter for cutting a panel from a single glass substrate(100) and a working stage(200) for loading the single glass substrate(100) thereon. The laser cutter includes a heating device for generating a laser beam to heat the single glass substrate and a cooling device for injecting a fluid beam to cool the single glass substrate. The heating device includes a laser generating unit, a refraction lens section, and a focusing lens section. The working stage(200) has a rectangular shape and is spaced from the laser cutter. A plurality of suction holes(210) are formed in the working stage(200) so as to fix the single glass substrate to an upper portion of the working stage(200). A plurality of pores(220) are formed in the working stage(200) so as to allow the laser beam to pass through the working stage(200).