CONTROLLING METHOD OF SEALING APPARATUS FOR PRODUCING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A controlling method of sealing apparatus is provided to adequately control the injection rate of a sealing material and the movement speed of a semiconductor package dispenser. CONSTITUTION: A determination is made to the X-Y axis movement speed of the dispenser and the injection speed of the sealing material by sensing the size and height of the package through a camera and a height sensor. The package is supplied one by one to a conveying rail from a magazine containing the package used in the determination step. The package is raised to be heated for a desired time duration and conveyed to the conveying rail. A check is made to the size and height of the package if there is a change after raising the package again. A dam is formed on the surface of the package by the first dispenser if the package is the same one that used in the determination step.