HEAT-RESISTANT BOND PLY HAVING EXCELLENT ALKALI ETCHING PROPERTY

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant bond ply having excellent alkali etching property and free from significant difference between the alkali etching speeds of the base film layer and the thermoplastic polyimide layer of the heat-resistant bond ply. SOLUTION: The heat-resistant bond ply has a thermoplastic polyimide layer on at least one surface of a heat-resistant base film. The alkali etching speed of the thermoplastic polyimide layer is 1/10 to 10 times the alkali etching speed of the base film. A bond ply having excellent alkali etching property can be produced by using an ester acid dianhydride as the thermoplastic polyimide layer.