ELECTROPLATING EQUIPMENT AND METHOD

摘要

PROBLEM TO BE SOLVED: To enhance the film thickness of plating films and to improve the reliability of equipment by solving the problem that the film thickness of the plating film around a wafer tends to increase because electric fields are liable to concentrate near the points where electrodes are connected in a general electroplating method. SOLUTION: The AC impression electrode 17 is connected to the side opposite to the side of a substrate 51 where the plating films are deposited of the electroplating equipment 1 which forms the plating films on the substrate 51 by an electroplating method and this AC impression electrode 17 is provided with an AC power source 18 for impressing AC electric power to the electrode.