THINNER COMPOSITION FOR REMOVING PHOTOSENSITIVE RESIN COMPOSITION

摘要

PURPOSE: A thinner composition is provided, which is used to remove the photosensitive resin composition in the manufacturing process of a semiconductor device or a liquid display device. CONSTITUTION: The thinner composition comprises 30-85 parts by weight of propylene glycol monoalkyl ether; 1-40 parts by weight of monooxycarbonic acid ester; 1-55 parts by weight of alkyl ethanoate; 1-5 parts by weight of alkyl lactate; and 0.001-1 parts by weight of a fluorinated acrylic copolymer surfactant. Preferably the propylene glycol monoalkyl ether is propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether or propylene glycol monobutyl ether; the alkyl ethanoate is methyl ethanoate, ethyl ethanoate, isopropyl ethanoate, n-propyl ethanoate or butyl ethanoate.