| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent flowability and excellent curability and can give cured products that can achieve V-0 on a UL-94 vertical test without containing a flame retardant, hardly warps when subjected to a soldering treatment, and has excellent soldering crack resistance. SOLUTION: This epoxy resin composition for sealing area mounting type semiconductors is characterized by containing (a) an epoxy resin of formula (1), (b) an epoxy resin brained by the glycidyl-etherification of a mixture of phenolic compounds of formulas (2), and (3), a resin curing agent containing a resin curing agent of formula (4) in an amount of 30 to 100 wt.% based on the total resin curing agents, an inorganic filler, and a curing accelerator as essential components. Therein, the contents of the components (a) and (b) are 30 to 70 wt.% and 30 to 70 wt.%, respectively, based on the total epoxy resins, and the equivalent ratio of the epoxy groups in the total epoxy resins to the phenolic hydroxyl groups in the total resin curing agents is 0.5 to 2. The inorganic filler is contained in an amount of 75 to 95 wt.% based on the total epoxy resin composition, and the curing accelerator is contained in an amount of 0.4 to 25 pts.wt. per 100 pts.wt. of the sum of the total epoxy resin and the total resin curing agents.
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