发明名称 METHOD FOR PRODUCING LAMINATE FOR PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminate for a printed wiring board capable of forming a microcircuit required when a higher density of the printed wiring board is promoted and satisfying the flame retardance UL94-V without containing a halogen and an antimony flame retardant. SOLUTION: This method for producing a resin composition for the laminate is characterized is that the resin composition consists essentially of (a) a compound having a dihydrobenzoxazine ring in the molecule, (b) a compound capable of exhibiting reactivity with the dihydrobdenzoxazine ring or a phenolic hydroxy group produced after ring opening of the dihydrobenzoxamine ring and (C) a plating catalyst.
申请公布号 JP2002145974(A) 申请公布日期 2002.05.22
申请号 JP20000342387 申请日期 2000.11.09
申请人 HITACHI CHEM CO LTD 发明人 KAKIYA MINORU;TAKEDA YOSHIYUKI;OHORI KENICHI;MURAI AKIRA;HIRAI YASUYUKI;KAMOSHITA SHINICHI;ABE NORIHIRO
分类号 C08J5/24;C08G14/06;C08K3/00;C08L61/34;(IPC1-7):C08G14/06 主分类号 C08J5/24
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