发明名称 |
METHOD FOR PRODUCING LAMINATE FOR PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for a printed wiring board capable of forming a microcircuit required when a higher density of the printed wiring board is promoted and satisfying the flame retardance UL94-V without containing a halogen and an antimony flame retardant. SOLUTION: This method for producing a resin composition for the laminate is characterized is that the resin composition consists essentially of (a) a compound having a dihydrobenzoxazine ring in the molecule, (b) a compound capable of exhibiting reactivity with the dihydrobdenzoxazine ring or a phenolic hydroxy group produced after ring opening of the dihydrobenzoxamine ring and (C) a plating catalyst.
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申请公布号 |
JP2002145974(A) |
申请公布日期 |
2002.05.22 |
申请号 |
JP20000342387 |
申请日期 |
2000.11.09 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
KAKIYA MINORU;TAKEDA YOSHIYUKI;OHORI KENICHI;MURAI AKIRA;HIRAI YASUYUKI;KAMOSHITA SHINICHI;ABE NORIHIRO |
分类号 |
C08J5/24;C08G14/06;C08K3/00;C08L61/34;(IPC1-7):C08G14/06 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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