| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition which has good moisture absorption resistance and whose molded article surface is hardly discolored, even when heated and stored for a long period, and to provide a sealed elec tronic part device. SOLUTION: This sealing resin composition containing (A) an epoxy resin, (B) a para-alkylated phenolic resin not having hydrogen atoms at theα-positions and (C) an inorganic filler as essential components is characterized by containing (C) the inorganic filler in an amount of 60 to 95 wt.% based on the resin composition. And, the sealed electronic part device sealed with the composition.
|
