发明名称 Process involving metal hydrides
摘要 Metal hydrides are activated by an electrochemical procedure. A novel plating method, taking advantage of the reducing power of hydrogen absorbed in a metal hydride, is useful to encapsulate such metal hydride with a variety of metals. Therefore, such hydrides are uniformly coated by using plating solutions without the standard reducing agent and stabilizer. <IMAGE>
申请公布号 EP0753896(B1) 申请公布日期 2002.05.22
申请号 EP19960305143 申请日期 1996.07.12
申请人 AT&T IPM CORP. 发明人 HON LAW, HENRY;VYAS, BRIJESH
分类号 C01B6/00;C23C18/16;C23C18/18;C23C18/52;H01M4/04;H01M4/24;H01M4/38 主分类号 C01B6/00
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