发明名称 |
Process involving metal hydrides |
摘要 |
Metal hydrides are activated by an electrochemical procedure. A novel plating method, taking advantage of the reducing power of hydrogen absorbed in a metal hydride, is useful to encapsulate such metal hydride with a variety of metals. Therefore, such hydrides are uniformly coated by using plating solutions without the standard reducing agent and stabilizer. <IMAGE> |
申请公布号 |
EP0753896(B1) |
申请公布日期 |
2002.05.22 |
申请号 |
EP19960305143 |
申请日期 |
1996.07.12 |
申请人 |
AT&T IPM CORP. |
发明人 |
HON LAW, HENRY;VYAS, BRIJESH |
分类号 |
C01B6/00;C23C18/16;C23C18/18;C23C18/52;H01M4/04;H01M4/24;H01M4/38 |
主分类号 |
C01B6/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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