发明名称 RESIN COMPOSITION FOR THIN MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition having mechanical strengths hardly reduced by the heat at the time of molding. SOLUTION: This resin composition comprises (A) 10-95 wt.% polycarbonate obtained by subjecting a dihydric hydroxy compound and a carbonic diester to a polycondensation by an ester-interchange method in the presence of an ester-interchange catalyst, and (B) 90-5 wt.% liquid crystal polymer, and has >=70% proportion of an izod impact strength according to ASTM D256 (1/4 in thickness) of the product molded after 10 min retention based on that of the product molded after 3 min retention, i.e., the retention calculated by the formula: (Izod10/Izod3)×100 (wherein, Izod10 is the izod impact strength after the resin is retained for 10 min; and Izod 3 is the izod impact strength after the resin is retained for 3 min).
申请公布号 JP2002146172(A) 申请公布日期 2002.05.22
申请号 JP20000347486 申请日期 2000.11.15
申请人 DAICEL CHEM IND LTD 发明人 SHIMIZU KIYOSHI
分类号 C08J5/00;C08G64/06;C08G64/10;C08G64/30;C08K3/00;C08L25/04;C08L69/00;C08L101/12 主分类号 C08J5/00
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