| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which is obtained by impregnating a reinforcing fiber substrate with an epoxy resin varnish containing an inorganic filler and then drying the impregnated substrate and is used for a printed circuit board, and whose suitable number sheets can be laminated, heated and press-molded to give the laminate having excellent heat resistance and excellent dimensional stability and used for the printed circuit board without deteriorating the curing reactivity of the prepregs due to the inorganic filler. SOLUTION: This prepreg which is used for the printed circuit board and is obtained by impregnating a reinforcing substrate with an epoxy resin varnish comprising at least an epoxy resin, a phenol novolak resin as a curing agent for the epoxy resin, an imidazole compound, an inorganic filler and an organic solvent and then drying the impregnated substrate is characterized by using the phenol novolak resin together with 4,4'-diaminodiphenylsulfone as the curing agent.
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