ELECTRONIC COMPONENT

摘要

An electronic component device (A1) has a lead electrode at the edge thereof. A support member (A2) is opposed to the electronic component device with a gap (G) between them, and has an external connection terminal (A5) at the position opposing a lead electrode (A4). A resin layer (A3) is disposed between the electronic component device (A1) and the support member (A2) and is spaced apart by a distance (d) from the edge of the electronic component (A1). The resin layer (A3) bonds the electronic component device (A1) to the support member (A2). The distance (d) satisfies the relation G < d. A conductive agent (A6) is filled into the gap (G) between the lead electrode (A4) and the external connection terminal (A5) and into the space defined between the resin layer (A3) and the edge of the electronic component device (A1) having the distance d, and connects the lead (A4) to the external connection terminal (A5). When an electronic component is fitted to a printed board, inferior connection between the lead electrode and the external connection terminal does not occur.