RESIN COMPOSITION FOR INSULATION FILM AND INSULATION FILM USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for insulation film keeping excellent heat-resistance and enabling lowering of dielectric constant in semiconductor use and to provide an insulation film produced by using the composition. SOLUTION: The resin composition comprises as indispensable components (A) a multi-branched polymer composed of a dendrimer or a hyperbranch polymer and having a molecular size of 0.1-100 nm and (B) thermosetting polybenzoxazole precursor having the repeating unit expressed by general formula (1) and containing at least one acetylene structure or biphenylene structure.