| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for depositing a mixed metal or metal compound layer containing a solventless mixture of at least two metal ligand composite precursors and to provide a method for depositing the layer on an electronic material substrate. SOLUTION: The mixture is a liquid under external conditions. Then, the ligands are a composition selected from the groups consisting of alkyl, alkoxide, halides, hydrides, amides, imides, azides, nitrates, cyclopentadiethyl, carbonyl, pyrazole and their resemblances substituted with fluorine, oxygen and nitrogen.
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