| 摘要 |
PROBLEM TO BE SOLVED: To suppress fluctuation of sputtered film thickness on a semiconductor wafer even if a collimator opening diameter varies and to prevent dusting in a vacuum chamber, in a sputtering device equipped with a collimator. SOLUTION: In the sputtering device in which the collimator 4 with plural openings 9 is installed between a target 2 and a stage 7 in the vacuum chamber 1 and in which sputtering particles 3 are scattered vertically to the semiconductor wafer 6 placed on the stage 7; the installed position of the collimator 4 and a distance between the target 2 and the stage 7 are controlled on the basis of the collimator weight with no sputtered film deposited before the collimator is mounted on the sputtering device, as the characteristic of the device. The device is equipped with a collimator driving motor 5 for raising and lowering the collimator 4 and with a stage driving motor 8 for vertically moving the stage 7.
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