发明名称 MASTER PLATE FOR PRINTED WIRING
摘要 PROBLEM TO BE SOLVED: To provide a master plate for printed wiring having a photopolymerization layer which has high sensitivity for active rays and high resolution and generates excellent physical properties of the film. SOLUTION: The master plate for printed wiring has a photopolymerization layer containing a thermoplastic polymer binder, specified polymerizable compounds and photopolymerization initiator on a substrate which is prepared by forming a conductive thin film on an electric insulating plate.
申请公布号 JP2002148795(A) 申请公布日期 2002.05.22
申请号 JP20000344069 申请日期 2000.11.10
申请人 FUJI PHOTO FILM CO LTD 发明人 KONDO SHUNICHI;KUNIDA KAZUTO
分类号 G03F7/027;B32B15/08;B32B27/18;B32B27/30;C08F2/00;C08F2/44;C08F2/50;C08F291/00;G03F7/11;H05K3/06 主分类号 G03F7/027
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