Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument

摘要

A method of applying an adhesive material comprising the steps of: providing the adhesive material on an interconnect substrate; and pressure-bonding the adhesive material to the interconnect substrate. A base has a plurality of first regions to be punched out and second regions located between the first regions. An interconnect pattern is formed at least in the first regions. Part of the adhesive material located within the first regions is pressurized to flow toward the second regions to move air bubbles to the second regions.