发明名称 DEVICE AND METHOD FOR LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device with which an object to be machined which has been regarded as a defective product by an inspection is re-processed, thus the yield is improved. SOLUTION: The object to be machined is machined with a laser beam machining section and a bit of identification information is marked. The laser beam machining section reads out the bit of identification information marked on the object to be machined and restores the defective part of the object to be machined on the basis of the defect information corresponding to the bit of identification information. An inspection section reads out the bit of identification information marked on the object to be machined and inspects the object to be machined on the basis of a bit of working information corresponding to the bit of identification information.</p>
申请公布号 JP2002144059(A) 申请公布日期 2002.05.21
申请号 JP20000348520 申请日期 2000.11.15
申请人 SUMITOMO HEAVY IND LTD 发明人 ISO KEIJI
分类号 B25H7/04;B23K26/00;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 主分类号 B25H7/04
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