发明名称 RESIN SHEET AND METAL LAMINATE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a resin sheet and a metal laminated sheet for a multilayer circuit board having high reliability even with a thin thickness. SOLUTION: The resin sheet comprises a resin layer having a thickness of 5 to 100μm formed on one side surface of an aromatic polyamide film so that a thermal expansion coefficient of the sheet is 4×10-6 to 80×10-6/ deg.C. The metal laminate sheet comprises a metal laminated on the resin sheet.
申请公布号 JP2002144510(A) 申请公布日期 2002.05.21
申请号 JP20000340474 申请日期 2000.11.08
申请人 TORAY IND INC 发明人 ITO NOBUAKI;TSUKUDA AKIMITSU
分类号 B32B27/34;B32B15/08;B32B15/088;H05K1/03;(IPC1-7):B32B27/34 主分类号 B32B27/34
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