发明名称 |
RESIN SHEET AND METAL LAMINATE SHEET |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin sheet and a metal laminated sheet for a multilayer circuit board having high reliability even with a thin thickness. SOLUTION: The resin sheet comprises a resin layer having a thickness of 5 to 100μm formed on one side surface of an aromatic polyamide film so that a thermal expansion coefficient of the sheet is 4×10-6 to 80×10-6/ deg.C. The metal laminate sheet comprises a metal laminated on the resin sheet. |
申请公布号 |
JP2002144510(A) |
申请公布日期 |
2002.05.21 |
申请号 |
JP20000340474 |
申请日期 |
2000.11.08 |
申请人 |
TORAY IND INC |
发明人 |
ITO NOBUAKI;TSUKUDA AKIMITSU |
分类号 |
B32B27/34;B32B15/08;B32B15/088;H05K1/03;(IPC1-7):B32B27/34 |
主分类号 |
B32B27/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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