| 摘要 |
PROBLEM TO BE SOLVED: To bond an orifice plate sufficiently in close contact by adopting this method to a printer, particularly, in a type of ejecting ink drops by heating a heater in terms of the printer, a printer head and a method of making the printer head. SOLUTION: Wiring patterns 32A, 32B, 32C are disposed on a portion under a partition wall (13) in an ink liquid chamber. A step in a thickness direction is not formed at the partition wall (13) of at least the ink liquid chamber 16.
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