发明名称 |
Method of manufacturing semiconductor device by sputtering dielectric forming materials while selectively heating growing layer |
摘要 |
A method of manufacturing a semiconductor device, comprises the following steps of growing a dielectric film made of a dielectric material whose dielectric constant is improved by crystallization thereof, on a semiconductor substrate to utilize the dielectric film as a capacitor film, and applying a voltage to the semiconductor substrate in a plasma atmosphere to increase a grown interface temperature by "dielectric heating" upon growth of the dielectric film
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申请公布号 |
US6391797(B1) |
申请公布日期 |
2002.05.21 |
申请号 |
US19970923246 |
申请日期 |
1997.09.04 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TAKEHIRO SHINOBU;YAMAUCHI SATOSHI;YOSHIMARU MASAKI |
分类号 |
C23C14/06;C23C14/34;C23C14/40;H01L21/02;H01L21/314;H01L21/316;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/20 |
主分类号 |
C23C14/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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