发明名称 Method of manufacturing semiconductor device by sputtering dielectric forming materials while selectively heating growing layer
摘要 A method of manufacturing a semiconductor device, comprises the following steps of growing a dielectric film made of a dielectric material whose dielectric constant is improved by crystallization thereof, on a semiconductor substrate to utilize the dielectric film as a capacitor film, and applying a voltage to the semiconductor substrate in a plasma atmosphere to increase a grown interface temperature by "dielectric heating" upon growth of the dielectric film
申请公布号 US6391797(B1) 申请公布日期 2002.05.21
申请号 US19970923246 申请日期 1997.09.04
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 TAKEHIRO SHINOBU;YAMAUCHI SATOSHI;YOSHIMARU MASAKI
分类号 C23C14/06;C23C14/34;C23C14/40;H01L21/02;H01L21/314;H01L21/316;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/20 主分类号 C23C14/06
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