发明名称 METHOD AND APPARATUS FOR AUTOMATIC SOLDERING
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for automatic soldering in which a soldering condition can be easily set, and consistent soldering can be performed even when a member to be soldered is positionally deviated, or the ambient temperature is changed. SOLUTION: In this automatic soldering method for performing the automatic soldering to the member to be soldered while automatically controlling an automatic solder feeder and a soldering iron part mounted on a general-purpose robot, the automatic soldering is performed while automatically measuring the temperature of the member to be soldered by a non-contact temperature sensor.
申请公布号 JP2002144075(A) 申请公布日期 2002.05.21
申请号 JP20000339133 申请日期 2000.11.01
申请人 HITACHI CABLE LTD 发明人 OTOMO KENJI
分类号 B23K31/02;B23K3/02;B23K3/06;H05K3/34;(IPC1-7):B23K31/02 主分类号 B23K31/02
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