发明名称 |
Wafer level interposer |
摘要 |
An apparatus and method for manufacture and testing of semiconductor chips (14) is disclosed. The invention comprises the use of an interposer (22) having a plurality of electrical contact pads (26) on each surface connected by a plurality of conductors (32, 34). After assembly of the interposer (22) to a semiconductor wafer (12), the wafer-interposer assembly (10) is attached to a testing unit (46) wherein the semiconductor chips (14) on the wafer (12) are tested. After testing, the interposer-wafer assembly (10) is singulated into a plurality of chip assemblies (62), each chip assembly (62) comprising a silicon chip (64) and the permanently attached interposer (66). |
申请公布号 |
US6392428(B1) |
申请公布日期 |
2002.05.21 |
申请号 |
US19990440751 |
申请日期 |
1999.11.16 |
申请人 |
EAGLESTONE PARTNERS I, LLC |
发明人 |
KLINE JERRY D.;SMITH, JR. CECIL E. |
分类号 |
G01R1/04;G01R31/28;H01L21/66;H01L23/498;(IPC1-7):G01B31/02 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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