发明名称 METHOD AND DEVICE FOR LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and a device for laser beam machining by which the generation of a crack at a part being machined is prevented and the working time of the laser beam machining is shortened. SOLUTION: A work W is irradiated with a laser beam L with a YAG laser device 1 after the work W is preheated with an electric heater 21. By irradiating the face to be irradiated of the work W with laser beam after the work W is preheated, the difference in the temperatures before and after the irradiation of the laser beam L becomes smaller than that in the case where the work W is irradiated with the laser beam L when the temperature of the work is nearly equal to the room temperature. Thus, a thermal stress given to the machining zone of the work W is decreased and the generation of a crack is decreased. Further, by irradiating the work W with laser beam L after the work W is preheated, a heat input process is eliminated or the time required for the heat input process is shortened, and the working time of the laser beam machining is shortened.</p>
申请公布号 JP2002144058(A) 申请公布日期 2002.05.21
申请号 JP20000347201 申请日期 2000.11.14
申请人 RICOH MICROELECTRONICS CO LTD 发明人 KINOSHITA SHINGEN
分类号 B23K26/00;B23K26/08;(IPC1-7):B23K26/00 主分类号 B23K26/00
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