| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer grinding device capable of improving removing efficiency of grinding chips blocked inside a porous material by a simple constitution and washing method therefor. SOLUTION: An ultrasonic impression means 50 is provided inside a wafer holding means 51 mounted with the porous material 20 thereon. By the ultrasonic impression means 50, ultrasonic waves are applied to pressurized washing liquid L1 supplied from the inside of the wafer holding means 51 toward a surface 20a side of the porous material 20. The porous material 20 is washed by the pressurized washing liquid L1 applied with the ultrasonic waves. |
