| 摘要 |
PROBLEM TO BE SOLVED: To perform surface grinding with high accuracy and reduce force applied to a wafer by grinding with the micro depth of cut without leaving a grinding streak. SOLUTION: In this surface grinding method for a sheet disc-like workpiece W by grinding one side machined surface of the sheet disc-like workpiece W with the outer peripheral surface of a grinding wheel 7, the workpiece W and the grinding wheel 7 are respectively rotated on their axes, and the grinding wheel 7 is relatively moved in the radial direction of the workpiece W to grind the workpiece W.
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