发明名称 Resin shield circuit device
摘要 In the resin shield circuit device, a resin case is provided with a recess having an opening. Each end of connector terminals is exposed out of the resin case and the other end thereof is embedded into the resin case. Base portions of wiring metal pieces are embedded into the resin case and connected in circuit with the other ends of the connector terminals. Connecting portions of the wiring metal pieces protrude into the recess. Lead terminals of circuit elements are connected and fixed to the connecting portions, respectively. A resin shield portion filled in the recess covers the circuit elements and the connecting portions of the wiring metal pieces in such a manner that only a flat surface of the resin shield portion is exposed out of the opening of the recess to outside.
申请公布号 US6390854(B2) 申请公布日期 2002.05.21
申请号 US20010903653 申请日期 2001.07.13
申请人 DENSO CORPORATION 发明人 YAMAMOTO NAOKI;IRIE HITOSHI
分类号 H01L23/28;H01L25/04;H01L25/18;H01R13/66;H01R43/24;H05K3/20;H05K3/28;(IPC1-7):H01R13/66 主分类号 H01L23/28
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