发明名称 |
Integral solder and plated sealing cover and method of making the same |
摘要 |
A method of making an integral plated and solder clad cover lid for electronic packages is disclosed. The cover lid is plated and or clad with a first corrosion resistant and solderable material and is clad with a solder material on one side. The cladded substrate is stamped and then plated with a second corrosion resistant and solderable material. The second material is subsequently sintered and preferentially diffused into the solder material resulting in a visual distinction between the solder side of the cover lid and the backing side.
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申请公布号 |
US6390353(B1) |
申请公布日期 |
2002.05.21 |
申请号 |
US19990226339 |
申请日期 |
1999.01.06 |
申请人 |
WILLIAMS ADVANCED MATERIALS, INC. |
发明人 |
LICHTENBERGER HEINER |
分类号 |
B23K1/00;B23K35/00;B23K35/14;H01L23/02;(IPC1-7):B21D39/00;B23K35/12 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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