| 摘要 |
A mounting substrate includes: a base substrate having a usable substrate region used as part of a product and an unusable substrate region to be discarded, the base substrate being subjected to soldering treatment in which the surface thereof is brought into contact with solder; and on-substrate members arranged on a soldering surface side, to be subjected to the soldering treatment, of the base substrate, the on-substrate members being in a state in which the surfaces have a wettability against solder upon soldering treatment. The on-substrate members are arranged in a non-contact portion with solder upon solder treatment in the unusable substrate region, in the usable substrate region, or in the non-contact portion and the usable substrate region. With this configuration, even if solder is stuck on the on-substrate members, any noxious material containing waste does not occur when the unusable substrate region is separated from the usable substrate region and is discarded.
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