发明名称 Polyoxymethylene resin composition
摘要 A polyoxymethylene resin composition comprising:(A) 50 to 99 parts by weight of a polyoxymethylene resin;(B) 1 to 50 parts by weight of a wollastonite having a volume-average particle diameter of 0.5 to 40 mum;(C) 0.1 to 10 parts by weight of at least one member selected from the group consisting of an ester of an alcohol and a fatty acid, an ester of an alcohol and a dicarboxylic acid, and a compound of a polyoxyalkylene glycol based on 100 parts by weight of the total amount of Component (A) and Component (B); and(D) 0.1 to 10 parts by weight of a polyolefin resin based on 100 parts by weight of the total amount of Component (A) and Component (B).The composition of the present invention provides a molded product which is excellent in resistance to friction and wearing, has high stiffness, repeated impact strength, and small molding strain, and is excellent in gear precision as compared with conventional compositions. Therefore, the polyoxymethylene resin composition of the present invention can be provided as a new material for the electrical and electronic parts, down-sizing of which has been progressing.
申请公布号 US6391956(B1) 申请公布日期 2002.05.21
申请号 US20000508601 申请日期 2000.03.14
申请人 ASAHI KASEI KABUSHIKI KAISHA 发明人 HORIO MITSUHIRO;YOSHINAGA YUUJI
分类号 C08L59/02;(IPC1-7):C08K5/11 主分类号 C08L59/02
代理机构 代理人
主权项
地址