| 摘要 |
A method of processing a substantially wafer-shaped product in semiconductor technology is described, which product is designed for the formation of a number of electronic circuit bodies over at least a first of its main surfaces, which circuit bodies are to be mechanically separated substantially perpendicularly to the first main surface, and which product has a second main surface lying opposite the first main surface. To arrange such a method in a manner which renders possible an inexpensive manufacture of semiconductor technology products in combination with as simple a product handling as possible also in the case of more stringent requirements, in particular caused by the ever greater miniaturization of conductor structures of electronic circuits formed on these products, it is proposed according to the invention that, for carrying out processing steps on one of the main surfaces of the product, a layer of adhesive material is provided in a planar manner on the opposite main surface of the product, on which layer a carrier element of at least substantially stable shape is provided so as to achieve a planar connection to said opposite main surface of the product.
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