| 摘要 |
An actively cooled, heat-dissipating module is presented for dissipating thermal energy from a heat producing integrated circuit device. The heat-dissipating module features a tungsten carbide body having high-density fins and a base with an interfacial surface adapted for attachment to an IC device. The base may also be bonded at high-pressure and high-temperature to a sintered polycrystalline diamond buffer element that, in turn, features a metalized interfacial surface suitable for attachment to the device. The high-density fins present a combined surface area at least 20 times greater than the surface area of the interfacial surface of the buffer element or the base of the heat-dissipating module. The tungsten carbide fins are capable of withstanding high flow and high velocity fluid environments. The high surface area of the fins optimizes the convective transfer of thermal energy from the fins to the high flow of cooling fluid. By bonding the module adjacent to the IC device, the number of thermal junctions is reduced, and the efficiency of the junctions is increased.
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