发明名称 |
Resin-encapsulated semiconductor device |
摘要 |
A method for forming a mold-encapsulated semiconductor device includes the steps of mounting a semiconductor chip (15) on a metallic plate (11) having a metallic interconnect pattern (14) thereon, encapsulating the semiconductor chip (15) on the metallic interconnect pattern (14), removing the bottom of the metallic plate (11) by etching to expose the metallic interconnect pattern (14), and forming external terminals (18) on the bottom of the metallic interconnect pattern (14). The method reduces the thickness as well as the planar dimensions of the semiconductor device. |
申请公布号 |
GB2369245(A) |
申请公布日期 |
2002.05.22 |
申请号 |
GB20020002655 |
申请日期 |
2000.09.15 |
申请人 |
* NEC CORPORTION |
发明人 |
MICHIHIKO * ICHINOSE;TOMOKO * TAKIZAWA;HIROKAZU * HONDA;KEIICHIROU * KATA |
分类号 |
H01L23/28;H01L21/48;H01L21/56;H01L21/60;H01L21/68;H01L23/12;H01L23/31;H01L23/495;H01L23/498 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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