发明名称 Method of fabricating a polysilicon layer
摘要 The present invention is directed to a method of forming a polysilicon layer. A light shield layer having a super-resolution near-field structure is arranged on an amorphous silicon layer. The super-resolution near-field structure includes a first dielectric layer, a second dielectric layer, and an active layer between the first dielectric layer and the second dielectric layer. The light shield layer is irradiated by a laser beam having a first intensity to generate a transmitted laser beam having a second intensity. The second intensity is greater than the first intensity. An annealing process is performed to irradiate the amorphous silicon layer with the transmitted laser beam having a second intensity thereby converting the amorphous silicon layer into a polysilicon layer.
申请公布号 US6391395(B1) 申请公布日期 2002.05.21
申请号 US20000695438 申请日期 2000.10.23
申请人 RITEK CORPORATION 发明人 TSENG TZU-FENG;CHEN YI-MING;GUO WEN-REI
分类号 G02F1/136;G02F1/1368;H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H05H1/02 主分类号 G02F1/136
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