METHOD FOR MANUFACTURING EPOXY RESIN COMPOSITION TABLET AND SEMICONDUCTOR DEVICE OBTAINED BY USING THE TABLET

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an epoxy resin composition tablet for obtaining a semiconductor device without any void by transfer molding while the semiconductor device obtained by the manufacturing method is provided. SOLUTION: The method for manufacturing the epoxy resin composition tablet is provided wherein when the epoxy resin composition tablet is manufactured by putting the epoxy resin composition powder into a mortar set in a tablet machine to be pressurized by an upper pestle, pressurizing is carried out while vibration is added to the mortar.