发明名称 Method of bonding substrates
摘要 A substrate is permanently bonded to a thermoplastic member by applying a sufficient degree of heat and pressure. Thermoplastic is notoriously non-receptive to even the most aggressive adhesives. As such, it has been extremely difficult to attach non-plastic components to thermoplastic products. To avoid this problem, the thermoplastic product is heated, on one side, to a temperature just below its melting point. A substrate, made of a material such as polyethylene, is placed against the non-heated side of the thermoplastic. As heat passes through the thermoplastic, it heats and eventually melts a portion of the substrate. Ideally pressure is applied to force the melted material against the substrate. The materials are then allowed to cool and harden, thus forming a permanent bond between them. Additional materials may be coupled to the substrate, as desired.
申请公布号 US6391142(B1) 申请公布日期 2002.05.21
申请号 US20000479580 申请日期 2000.01.07
申请人 DEININGER STEVEN T. 发明人 DEININGER STEVEN T.
分类号 C09J5/06;(IPC1-7):B32B31/00 主分类号 C09J5/06
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